Amtech Systems, Inc. (OQ:ASYS)
Business Focus: Semiconductor Equipment & Testing
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Company News
Feb 09, 2024 16:05 ET
Amtech Reports First Quarter 2024 Results
Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications, today reported results for its first quarter ended December 31, 2023.
Feb 08, 2024 17:37 ET
Amtech Systems to Announce First Quarter 2024 Financial Results on Friday, February 9, 2024
Amtech Systems, Inc. ("Amtech") (NASDAQ: ASYS), a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications, will announce its first quarter 2024 financial results for the period ended December 31, 2023, on Friday, February 9, 2024, after market close.
Valuation Ratios
Industry
Sector
Beta
1.41
--
--
Price to Sales - TTM
0.65
5.18
2.70
Price to Book - most recent quarter
0.95
3.21
2.04
Price to Cash Flow per share - TTM
--
17.77
14.11
Price to Free Cash Flow per share - TTM
--
34.16
25.36
Business Summary
| Sector: Technology | Industry: Semiconductor Equipment & Testing |
Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.
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